Technical Library


Polysilanes have applications as preceramic polymers and photolabile coatings. Applications for polysilanes with methyl and phenyl group substitution are usually limited to silicon carbide precursors.

polysilanes -(Si-Si)-

Product CodeNameCASComments
PSS-1K02poly(perchlorosilane) oligomersolid
4 or more silicon atoms
MW: 1,000-3,000, DP: 25-50, Flashpoint: 103 °C
Tm: 250-270 °C (substantial degradation before Tm)
PSS-1P01(50% dimethylsilane)(50% phenylmethylsilane) copolymer[143499-71-2]solid
PSS-1P11poly(phenylmethylsilane)[146088-00-8]Density: 1.12
Tg: 112-122 °C
fluorescent emission: 360 nm
*Solid state source for volatile siliconcarbonitride (SiCN) precursors utilized in passivation of silicon-based photovoltaics
Employed in CVD of silicon carbonitride films (Scarlete, M.; et al; US Patent 7,396,563; 2008 (Label Licensed Gelest Product))
Intermediate for polycarbosilanes. (Yajima, S. et al. J. Mater. Sci. 1978, 13, 2569.)

Poly(dimethylsilane), PSS-1M01

Polysilazanes are preceramic polymers primarily utilized for the preparation of silicon nitride for thermal shock resistant refractories and dielectric coatings for microelectronics. (Kroke, E. et al, Material Science and Engineering Reports, 2000, 26, 97.)

polysilazanes -(Si-N)-

Product CodeNameCASComments
PSN-2H01.2poly(perhydrosilazane)[176948-80-4]10 wt% in heptanes
PSN-2M01poly(1,1-dimethylsilazane) telomer[89535-60-4]Tg: -82 °C
Viscosity > 50 cSt
MW: 500-900
D420: 1.04
PSN-2M02poly(1,1-dimethylsilazane) crosslinked--Viscosity: > 1,000 cSt.
15-20% char at 700 °C
PSN-2M11poly(1,2-dimethylsilazane) crosslinked--Viscosity: 100-300 cSt
D420: 0.99

Preceramic Polymers - Borosilicate

Product CodeNameCASComments
Tg: 95-100 °C, Tm: 140-141 °C
employed in preparation of ceramic fibers (Yajima, S.; et al, Nature, 1977, 266, 521.)

Hybrid organic-inorganic polymers containing alkoxy substitutions on silicon allow formulation of moisture-cure adhesives, sealants, and elastomers with physical properties, including adhesion and strength which are significantly higher than conventional silicones. Moisture produces a condensation cure analogous to moisture-cure silicones. Preferred catalysts are dibutylbispentanedionatetin, dimethyldineodecanoate tin and dibutyldilauryltin at levels of 0.2-1.0%. In order to allow through-section cure, maximum thickness is usually 1/4 in (5 mm).


Product CodeStructureCommentsCAS
SIB1660.0Base resin for tin catalyzed moisture-cure RTVs[75009-80-0]
SIB1824.84Hydrolytically stable hydrophilic silane
Proton conducting polymer electrolyte (Ghosh, B. et al. Chem. Mater. 2010, 22, 1483.)
SIB1824.82Dipodal hydrophilic silane
In combination with sulfolane forms gel electrolyte for solar cells (Stathatos, E. et al. Adv. Funct. Mater. 2004, 14, 45.)
Forms proton conducting hybrid organic-inorganic polymer electrode membranes. (Honma, I. et al. J. Membr. Sci. 2001, 185, 83.)
Antifog coatings can be formed from combinations of polyalkylene oxide-functional silanes and film-forming hydrophilic silanes


Product CodeStructureNameViscosity (cSt)Molecular WeightDensityCASComments
SSP-055triethoxysilyl-modified poly-1,2-butadiene, 50% in toluene75-4003,500-4,5000.90[72905-90-9] coupling agent for EPDM resins
SSP-056triethoxysilyl-modified poly-1,2-butadiene, 50% in volatile silicone600-1,2003,500-4,5000.93[72905-90-9]primer coating for silicone rubbers
SSP-058diethoxymethylsilyl-modified poly-1,2-butadiene, 50% in toluene75-1503,500-4,5000.90--water tree resistance additive for crosslinkable HDPE cable cladding
SSP-255(30-35%triethoxysilylethyl)ethylene-(35-40% 1,4-butadiene)-(25-30% styrene) terpolymer, 50% in toluene20-303,500-4,5000.92----


Product CodeStructureNameViscosity (cSt)Molecular WeightDensityCASNitrogen substitutionComments
SSP-060trimethoxysilylpropyl-modified (polyethylenimine), 50% in isopropanol125-1751,500-1,8000.92[136856-91-2]/[37251-86-8]
~20%employed as a coupling agent for polyamides. (Arkles, B; et al, SPI 42nd Composite Inst. Proc., 21-C, 1987)
in combination with glutaraldehyde immobilizes enzymes. (Cramer, S; et al, Biotech. & Bioeng. 1989, 33(3), 344.)
SSP-065dimethoxymethylsilylpropyl-modified (polyethylenimine), 50% in isopropanol100-2001,500-1,8000.92[1255441-88-5]
~20%primer for brass

Thermoplastic Resins for Melt Processing or Solution Casting

Product CodeStructureNameDensityCASComments
SSP-080(dimethylsiloxane)(bisphenol -a carbonate) copolymer1.19[202483-49-6]
(15-20% polydimethylsiloxane)
thermoplastic; tensile strength: 50 MPa
Vicat mp: 145 °C
SSP-085(dimethylsiloxane)(etherimide) copolymer1.18[99904-16-2]
(35-40% polydimethylsiloxane)phenylenediaminepolyetherimide
thermoplastic; tensile strength: 2800 psi
Tg: 168 °C
SSP-070poly(trimethylsilyl)propyne--[87842-32-8]PO2/PN2 = 1.7
forms viscous 5% solutions in toluene/tetrahydrofuran
high oxygen permeability (Masuda, T.; et al, J. Am. Chem. Soc., 1983, 105, 7473. Claes, S. et al, J. Membrane Sci., 2012, 389, 459. Claes, S. et al, Macromolecules, 2011, 44, 2766.)
SSP-050(dimethylsiloxane)(etherimide) copolymer0.927[35312-82-4]
0.5-1.2 mole % vinyltrimethoxysilane-ethylene copolymer
moisture crosslinkable thermoplastic
melt process temp: 170 - 200 °C