Polysilanes have applications as preceramic polymers and photolabile coatings. Applications for polysilanes with methyl and phenyl group substitution are usually limited to silicon carbide precursors.
polysilanes -(Si-Si)-
| Product Code | Name | CAS | Comments |
|---|---|---|---|
| PSS-1C01 | poly(dicyclohexylsilane) | solid | |
| PSS-1H01 | poly(dihexylsilane) | [207925-46-0] | solid |
| PSS-1K02 | poly(perchlorosilane) oligomer | solid 4 or more silicon atoms |
|
| PSS-1M01* | poly(dimethylsilane) | [30107-43-8]/[28883-63-8] TSCA | MW: 1,000-3,000, DP: 25-50, Flashpoint: 103 °C Tm: 250-270 °C (substantial degradation before Tm) |
| PSS-1P01 | (50% dimethylsilane)(50% phenylmethylsilane) copolymer | [143499-71-2] | solid |
| PSS-1P11 | poly(phenylmethylsilane) | [146088-00-8] | Density: 1.12 Tg: 112-122 °C fluorescent emission: 360 nm |
Employed in CVD of silicon carbonitride films (Scarlete, M.; et al; US Patent 7,396,563; 2008 (Label Licensed Gelest Product))
Intermediate for polycarbosilanes. (Yajima, S. et al. J. Mater. Sci. 1978, 13, 2569.)
Poly(dimethylsilane), PSS-1M01
Polysilazanes are preceramic polymers primarily utilized for the preparation of silicon nitride for thermal shock resistant refractories and dielectric coatings for microelectronics. (Kroke, E. et al, Material Science and Engineering Reports, 2000, 26, 97.)
polysilazanes -(Si-N)-
| Product Code | Name | CAS | Comments |
|---|---|---|---|
| PSN-2H01.2 | poly(perhydrosilazane) | [176948-80-4] | 10 wt% in heptanes |
| PSN-2M01 | poly(1,1-dimethylsilazane) telomer | [89535-60-4] | Tg: -82 °C Viscosity > 50 cSt MW: 500-900 D420: 1.04 |
| PSN-2M02 | poly(1,1-dimethylsilazane) crosslinked | -- | Viscosity: > 1,000 cSt. 15-20% char at 700 °C |
| PSN-2M11 | poly(1,2-dimethylsilazane) crosslinked | -- | Viscosity: 100-300 cSt D420: 0.99 |
Preceramic Polymers - Borosilicate
| Product Code | Name | CAS | Comments |
|---|---|---|---|
| SSP-040 | poly(borodiphenylsiloxane) | [70914-15-7] TSCA | solid Tg: 95-100 °C, Tm: 140-141 °C |
Hybrid organic-inorganic polymers containing alkoxy substitutions on silicon allow formulation of moisture-cure adhesives, sealants, and elastomers with physical properties, including adhesion and strength which are significantly higher than conventional silicones. Moisture produces a condensation cure analogous to moisture-cure silicones. Preferred catalysts are dibutylbispentanedionatetin, dimethyldineodecanoate tin and dibutyldilauryltin at levels of 0.2-1.0%. In order to allow through-section cure, maximum thickness is usually 1/4 in (5 mm).
Polyethers
| Product Code | Structure | Comments | CAS |
|---|---|---|---|
| SIB1660.0 |  | Base resin for tin catalyzed moisture-cure RTVs | [75009-80-0] |
| SIB1824.84 |  | Hydrolytically stable hydrophilic silane Proton conducting polymer electrolyte (Ghosh, B. et al. Chem. Mater. 2010, 22, 1483.) | [666829-33-0] |
| SIB1824.82 |  | Dipodal hydrophilic silane In combination with sulfolane forms gel electrolyte for solar cells (Stathatos, E. et al. Adv. Funct. Mater. 2004, 14, 45.) Forms proton conducting hybrid organic-inorganic polymer electrode membranes. (Honma, I. et al. J. Membr. Sci. 2001, 185, 83.) | [178884-91-8] |
Polybutadiene
| Product Code | Structure | Name | Viscosity (cSt) | Molecular Weight | Density | CAS | Comments |
|---|---|---|---|---|---|---|---|
| SSP-055 |  | triethoxysilyl-modified poly-1,2-butadiene, 50% in toluene | 75-400 | 3,500-4,500 | 0.90 | [72905-90-9] | coupling agent for EPDM resins TSCA |
| SSP-056 | | triethoxysilyl-modified poly-1,2-butadiene, 50% in volatile silicone | 600-1,200 | 3,500-4,500 | 0.93 | [72905-90-9] | primer coating for silicone rubbers TSCA |
| SSP-058 |  | diethoxymethylsilyl-modified poly-1,2-butadiene, 50% in toluene | 75-150 | 3,500-4,500 | 0.90 | -- | water tree resistance additive for crosslinkable HDPE cable cladding |
| SSP-255 |  | (30-35%triethoxysilylethyl)ethylene-(35-40% 1,4-butadiene)-(25-30% styrene) terpolymer, 50% in toluene | 20-30 | 3,500-4,500 | 0.92 | -- | -- |
Polyamine
| Product Code | Structure | Name | Viscosity (cSt) | Molecular Weight | Density | CAS | Nitrogen substitution | Comments |
|---|---|---|---|---|---|---|---|---|
| SSP-060 |  | trimethoxysilylpropyl-modified (polyethylenimine), 50% in isopropanol | 125-175 | 1,500-1,800 | 0.92 | [136856-91-2]/[37251-86-8] TSCA | ~20% | employed as a coupling agent for polyamides. (Arkles, B; et al, SPI 42nd Composite Inst. Proc., 21-C, 1987) in combination with glutaraldehyde immobilizes enzymes. (Cramer, S; et al, Biotech. & Bioeng. 1989, 33(3), 344.) |
| SSP-065 |  | dimethoxymethylsilylpropyl-modified (polyethylenimine), 50% in isopropanol | 100-200 | 1,500-1,800 | 0.92 | [1255441-88-5] TSCA | ~20% | primer for brass |
Thermoplastic Resins for Melt Processing or Solution Casting
| Product Code | Structure | Name | Density | CAS | Comments |
|---|---|---|---|---|---|
| SSP-080 |  | (dimethylsiloxane)(bisphenol -a carbonate) copolymer | 1.19 | [202483-49-6] TSCA | (15-20% polydimethylsiloxane) thermoplastic; tensile strength: 50 MPa Vicat mp: 145 °C |
| SSP-085 |  | (dimethylsiloxane)(etherimide) copolymer | 1.18 | [99904-16-2] TSCA | (35-40% polydimethylsiloxane)phenylenediaminepolyetherimide thermoplastic; tensile strength: 2800 psi Tg: 168 °C |
| SSP-070 |  | poly(trimethylsilyl)propyne | -- | [87842-32-8] | PO2/PN2 = 1.7 forms viscous 5% solutions in toluene/tetrahydrofuran high oxygen permeability (Masuda, T.; et al, J. Am. Chem. Soc., 1983, 105, 7473. Claes, S. et al, J. Membrane Sci., 2012, 389, 459. Claes, S. et al, Macromolecules, 2011, 44, 2766.) |
| SSP-050 |  | (dimethylsiloxane)(etherimide) copolymer | 0.927 | [35312-82-4] TSCA | 0.5-1.2 mole % vinyltrimethoxysilane-ethylene copolymer moisture crosslinkable thermoplastic melt process temp: 170 - 200 °C |